Planned capability
Automated design-rule analysis
We're designing the platform to check interconnect layouts against foundry rules as you work — flagging density, spacing, and signal-integrity risks before a design ever reaches the fab.
Semiconductor design & engineering studio · Est. 2026
Advanced packaging design for the quantum era.
QubitPack designs TSV and wafer-scale interconnect architectures for quantum hardware teams — and advises them from specification all the way to foundry handoff.
- 3
- Practice areas
- 300mm
- Design target platform
- EU
- Based in Spain
Quantum Computing
Quantum Sensing
Quantum Communications
Materials Science
Telecommunications
Cybersecurity
Aerospace & Defense
Advanced Research
Quantum Computing
Quantum Sensing
Quantum Communications
Materials Science
Telecommunications
Cybersecurity
Aerospace & Defense
Advanced Research
What we do
A design and engineering studio built for the quantum era
Quantum hardware is only as good as the packaging underneath it. That's where we come in. QubitPack is a young studio — founded in March 2026 — working across three practices: design, consulting, and software, all centred on the 300mm quantum wafer platform.
We don't run a fab, and that's deliberate. We design and advise, then hand off to whichever foundry our client chooses. Because we have no production line of our own to fill, the advice we give is only ever about what's best for your device — whether you're building in computing, sensing, or communications.
Packaging & interconnect design
We design TSV architectures and wafer-scale interconnect layouts, delivered as clean design files and documentation your chosen foundry can build from.
Technical consulting
From wafer specification to advanced packaging strategy and foundry selection, we give quantum teams independent, vendor-neutral guidance they can act on.
Software platform (in development)
We're building a design and analysis tool for packaging engineers. It is pre-launch and not yet available, but it shapes everything we do today.
Core expertise
Engineering depth across the packaging stack
Four disciplines shape every design we deliver — from TSV architecture and design-for-test to PDK-aligned layouts and a clean handoff to your foundry.
TSV architecture design
We lay out Through-Silicon Via architectures that pack dense vertical interconnect into a design without compromising signal integrity.
Design-for-test
We design so wafers can be tested and characterized in-line at your foundry, catching issues while they are still cheap to fix.
PDK-aligned layouts
Every design is drawn against your foundry’s Process Design Kit, so what we hand over is genuinely manufacturable, not just theoretical.
Foundry-ready handoff
You receive complete design files and documentation packaged for a clean handoff to the fab you have chosen to build with.
Software platform · In development
We're building a platform for packaging engineers
Alongside our design and consulting work, we're developing a tool to design and analyze advanced packaging. It is pre-launch and not yet available — here is what we're building toward.
Preview
A design workspace, PDK-aware from the start
The workspace we're building will map your packaging design against a foundry's Process Design Kit as you go. It is still in development and not yet publicly available.
QubitPack Studio · Coming soon
Real-time validationTSV & wafer-scale bumping
Who we design for
View all servicesDesign expertise across quantum technologies
We support teams with packaging design and advisory work across every major quantum technology sector.
Quantum Computing
Packaging and interconnect designs for the qubits and processors driving the next leap in computational capability.
Learn moreQuantum Sensing
Design and advisory support for ultra-precise sensing hardware used in materials science, navigation, and detection.
Learn moreQuantum Communications
Interconnect architectures for the secure networks of the future — the backbone of quantum-grade communication.
Learn more
| Metric | Value | Detail |
|---|---|---|
| Practice areas | 3 | Design · Consulting · Software |
| Design target platform | 300mm | The wafers we design toward |
| Independence | 100% | Vendor-neutral, no fab of our own |
| Founded | Mar 2026 | Built for the quantum age |
How it works
From first brief to foundry-ready design
A clear, repeatable engagement that takes your device from first specification to a packaging design your foundry can build.
- Step 1
Quantum Design Kit
Submit specsShare your requirements
Tell us about your device and constraints. We review your specs and the Process Design Kit of the foundry you plan to build with.
- Step 2WAFER
We design & review
We design your TSV and wafer-scale interconnect architecture, then run design-for-manufacturing reviews against your foundry’s rules.
- Step 3SkJust now
Packaging Design Package
QubitPack · Foundry-ready handoff
v1.0FINALTSV layoutBumpingDFM reviewReady for foundryView filesFoundry-ready handoff
You receive complete design files and documentation, packaged for a clean handoff to the fab you have chosen to build with.
Design for the 300mm platform
Packaging designs, ready for your foundry
Everything we deliver is built around the 300mm quantum wafer your device will eventually be made on. We handle the packaging design and the advisory work, so your team can spend its energy on the quantum breakthrough instead of the interconnect layout.
- TSV and wafer-scale interconnect architectures, delivered as complete design files
- Design-for-manufacturing reviews against your foundry’s full rule deck
- Handoff packages your fab can build from directly
- Independent advice from first specification through to foundry selection
Why QubitPack
Built to make quantum hardware achievable
From the first design review to a foundry-ready handoff, everything we do is aimed at helping teams build advanced quantum hardware faster and with more confidence.
Design Done Right
TSV and wafer-scale interconnect architectures laid out for signal integrity and density — so your device works the first time it is built.
- scan_die.gds
Design-for-Manufacturing
Every layout is reviewed against your foundry’s real rules, so problems surface on the screen instead of on the wafer.
Independent Advice
We don’t run a fab, so our guidance on specification, packaging strategy, and foundry selection is never tied to a production line.
Expertise on Tap
Bring us in for a full design engagement or a focused consult — from a single review to specification through to foundry handoff.
The quantum era will not be won by the cleverest qubit alone — it will be won by the teams who get the packaging and interconnects right. That is the problem we help our partners solve.
The QubitPack Philosophy
Our founding principle, since 2026
Ready to design your next quantum package?
Work with QubitPack on the packaging design and advisory that takes your quantum device from specification to a foundry-ready handoff.